2004.01 Preparatory office established.

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2004.05 Officially incorporated with a paid-in capital of NT$100 million.

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2006.07 Approved by Hsinchu Science Park Administration to station in the Park.

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2006.09 Initial public offering of SOI shares.

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2007.04 Shares listed on the Emerging Stock Market.

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2010.01 Obtained ISO9001 international certification.

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2011.12 Compensation Committee established.

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2012.03 Board of Directors resolved to conduct a share swap with Nueva Imaging, Inc. (U.S.) through new share issuance; approved by the Annual General Meeting.

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2012.09 Completed share swap with Nueva Imaging, Inc. (U.S.); paid-in capital increased to NT$620.79 million.

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2012.10 Completed cash capital increase; paid-in capital reached NT$651.009 million.

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2014.01 Established Silicon Optronics (Shanghai) Co., Ltd.

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2017.08 Elected the 7th Board of Directors; Mr. Hsin-Ping Ho reappointed as Chairman.

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2017.08 Audit Committee established.

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2018.07 Conducted pre-IPO cash capital increase; paid-in capital increased to NT$772.659 million.

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2018.10 Participated in Beijing International Security Expo; showcased backside illumination (BSI) with enhanced near-infrared sensing technology.

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2019.10 Participated in Shenzhen International Security Expo; exhibited industrial global shutter sensor technology.

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2020.06 Elected the 8th Board of Directors.

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2020.10 Launched BSI 4K/8M sensor product JX-K08.

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2020.11 Launched new generation FSI products JX-F53/F37 series, featuring lower power consumption and enhanced performance.

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2021.06 Launched BSI 1080P sensor product JX-F352.

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2021.07 Successfully developed AEC-Q100 automotive-grade packaging products.

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2021.10 Expanded BSI and NIR sensor product lines: introduced 5MP JX-K305P, followed by 2MP and 4MP products.

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2022.02 First global shutter sensor JX-S02 successfully mass-produced and launched.

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2022.04 Egis Technology Inc. completed tender offer for 15.9% of SOI’s shares.

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2022.08 Egis Technology Inc. continued acquisitions in the open market; total shareholding reached 16.17% by end of August.

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2022.10 Introduced RGB-IR products based on BSI and NIR technology, targeting smart cockpit and recognition systems.

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2023.01 Released new 1:1 4MP ultra-low power sensor K351P, supporting always-on AI detection and pre-recording.

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2023.03 Launched new 4K 8MP BSI and NIR sensor products.

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2023.11 Introduced new generation 2K sensor K306P with improved performance and cost efficiency.

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2024.01 Released 5MP 16:9 sensor K317P with low-power "Always On" functionality.

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2024.02 Launched new generation FSI design JX-K251, a 1:1 4MP sensor with enhanced cost advantages.

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2025.03 Board of Directors approved the promotion of Mr. Bob Chen as President.